Canon announces a high-precision wafer alignment measurement device MS-001 in Japan

Canon announced these days the start in Japan of a high-precision wafer alignment measurement system for semiconductor lithography programs, the MS-001.To manufacture semiconductor gadgets, wafer deformation must be calculated properly in get to overlay and expose with significant precision various levels of circuit styles within a collection of lithography devices. The Canon MS-001 makes it possible for the the greater part of alignment measurements to be carried out in a single batch process—outside the lithography program, ahead of it gets the wafer—thus strengthening the productivity of the lithography program by cutting down the range of measurements performed inside them.

Canon’s MS-001, geared up with an alignment scope that adopts an place sensor for multiple-pixel, minimal-noise imaging can evaluate even lower-distinction alignment marks, building feasible measurement of a lot more kinds of alignment marks than can be measured by typical lithography units. In addition, a recently created light resource for the alignment scope permits MS-001 to use 1.5 instances the wavelength range of measurements, offering consumers much more independence in deciding upon wavelength bands for measurement. Canon MS-001 can measure alignment marks with increased accuracy than regular semiconductor lithography units.

Luis Robinson

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